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2003/05/22
SiS and TECO Forge Alliance to Enter IA Market by Integrating Production and Marketing Systems

Taipei, May 22, 2003 - Silicon Integrated Systems Corp. (SiS), a leading supplier of core logic chipsets, and TECO Electric and Machinery Co., Ltd. (TECO), a leading manufacturer of IA products, announce their cooperation to penetrate the IA market with their quality Thin Client series products.

The Thin Client TR2220, introduced by TECO at CeBIT 2003 in Hannover, had a successful debut with sales to triple by the end of the year, according to TECO. Based on this achievement, SiS and TECO will further cooperate to develop new IA products, which may be globally marketed in June or July 2003.

With the integrated SoC chip architecture of SiS550 and the Win CE embedded system, TR2220 provides customers with higher reliability than competing brands. The power consumption of TR2220 is significantly low, saving energy by up to 70% of standard desktop computers.


TR2220

SiS contributes its SiS550 SoC chip as the core component of TR2220. This highly integrated chipset contains X86 CPU, south and north bridges, 2D circuits, and other controller circuits to minimize required components and power loss.

"TECO is the industry-leading manufacturer in planning of total solutions, development of embedded systems and control of market accesses," said Michael Chen, president and CEO of SiS. "It is strong in market niche creation and has high achievement in the Thin Client market. SiS is pleased to partner with TECO."

SiS will provide full tech support for TECO's application while TECO will focus on efficient marketing strategies, and both partners expect to make significant inroads in the global Thin Client market under their close cooperation.